Inside the Briefcase

How to align your visual brand guidelines and create consistently on-brand content

How to align your visual brand guidelines and create consistently on-brand content

In this ebook, we’ll explore the various themes leading...

Your B2B Content Strategy in 2017: How To Think Like A Movie Studio + 6 Other Tactics

Your B2B Content Strategy in 2017: How To Think Like A Movie Studio + 6 Other Tactics

Jon Lombardo, Creative Lead, LinkedIn, reveals in this presentation...

2017 State of Technology Training

2017 State of Technology Training

Pluralsight recently completed an in-depth survey of 300 enterprises...

IT Briefcase Exclusive Interview: Keeping Your (Manufacturing) Head in the Clouds

IT Briefcase Exclusive Interview: Keeping Your (Manufacturing) Head in the Clouds

with Srivats Ramaswami, 42Q
In this interview, Srivats Ramaswami,...

IT Briefcase Exclusive Interview: New Solutions Keeping Enterprise Business Ahead of the Game

IT Briefcase Exclusive Interview: New Solutions Keeping Enterprise Business Ahead of the Game

with Sander Barens, Expereo
In this interview, Sander Barens...

IBM In Hybrid Chip Breakthrough

December 1, 2010 No Comments

IBM unveiled new microprocessor technology that combines optical and electrical components on a single piece of silicon, paving the way for exascale computers that could be up to 1,000 times faster than current systems.

IBM’s CMOS Integrated Silicon Nanophotonics technology lets chips within a system communicate through pulses of light. The technology could be the foundation for computers that are faster, smaller, and more energy efficiency than anything currently available, according to IBM.

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