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Ironclad SaaS Security for Cloud-Forward Enterprises

Ironclad SaaS Security for Cloud-Forward Enterprises

The 2015 Anthem data breach was the result of...

The Key Benefits of Using Social Media for Business

The Key Benefits of Using Social Media for Business

Worldwide, there are more than 2.6 billion social media...

Gartner IT Sourcing, Procurement, Vendor and Asset Management Summit 2018, September 5 – 7, in Orlando, FL

Gartner IT Sourcing, Procurement, Vendor and Asset Management Summit 2018, September 5 – 7, in Orlando, FL

Register with code GARTITB and save $350 off the...

Infographic: The Three Pillars of Digital Identity: Trust, Consent, Knowledge

Infographic: The Three Pillars of Digital Identity: Trust, Consent, Knowledge

8,434 adults were surveyed to gauge consumer awareness of...

FICO Scales with Oracle Cloud

FICO Scales with Oracle Cloud

Doug Clare, Vice President at FICO, describes how Oracle...

IBM In Hybrid Chip Breakthrough

December 1, 2010 No Comments

IBM unveiled new microprocessor technology that combines optical and electrical components on a single piece of silicon, paving the way for exascale computers that could be up to 1,000 times faster than current systems.

IBM’s CMOS Integrated Silicon Nanophotonics technology lets chips within a system communicate through pulses of light. The technology could be the foundation for computers that are faster, smaller, and more energy efficiency than anything currently available, according to IBM.

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