Inside the Briefcase

IT Briefcase Exclusive Interview: Keeping Your (Manufacturing) Head in the Clouds

IT Briefcase Exclusive Interview: Keeping Your (Manufacturing) Head in the Clouds

with Srivats Ramaswami, 42Q
In this interview, Srivats Ramaswami,...

IT Briefcase Exclusive Interview: New Solutions Keeping Enterprise Business Ahead of the Game

IT Briefcase Exclusive Interview: New Solutions Keeping Enterprise Business Ahead of the Game

with Sander Barens, Expereo
In this interview, Sander Barens...

IT Briefcase Exclusive Interview: The Tipping Point – When Things Changed for Cloud Computing

IT Briefcase Exclusive Interview: The Tipping Point – When Things Changed for Cloud Computing

with Shawn Moore, Solodev
In this interview, Shawn Moore,...

Driving Better Outcomes through Workforce Analytics Webcast

Driving Better Outcomes through Workforce Analytics Webcast

Find out what’s really going on in your business...

Legacy Modernization: Look to the Cloud and Open Systems

Legacy Modernization: Look to the Cloud and Open Systems

On the surface, mainframe architecture seems relatively simple: A...

IBM In Hybrid Chip Breakthrough

December 1, 2010 No Comments

IBM unveiled new microprocessor technology that combines optical and electrical components on a single piece of silicon, paving the way for exascale computers that could be up to 1,000 times faster than current systems.

IBM’s CMOS Integrated Silicon Nanophotonics technology lets chips within a system communicate through pulses of light. The technology could be the foundation for computers that are faster, smaller, and more energy efficiency than anything currently available, according to IBM.

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